TSRI 成果發表會

會議時間/地點: 7/30(二) 15:00-17:30,台中福容大飯店 櫻花桂花廳

2024議程:
時間 內容
15:00~15:10 開場 / 致詞人:侯主任
15:10~15:55 頒獎 – 年度優良晶片頒獎
15:55~16:10 TSRI 重大策略說明
講者:侯拓宏主任
16:10~16:25 TSRI 晶片服務業務說明
講者:莊英宗副主任
16:25~17:10 Q&A 45分鐘
17:10~17:30 摸彩活動

TSRI 成果展示區

地點:1樓走廊

  1. Arm Cortex-M55 AIoT SoC Design Platform_設計服務組
  2. 智慧感測異質整合技術平台_異質整合晶片組/異質整合製程組
  3. Sub-THz量測技術與服務平台_電子量測技術組
  4. 超低溫晶圓級電性量測技術_電子量測技術組

TSRI 成果發表會


TSRI 重大策略說明



  • 侯拓宏 Tuo-Hung Hou
    • Taiwan Semiconductor Research Institute(TSRI) / Director General




  • 日期:2024年7月30日(二)
  • 時間:15:55 - 16:10
  • 地點:台中福容大飯店 櫻花桂花廳

Biography:

Dr. Tuo-Hung Hou received his B.S. and M.S. in electronics engineering from National Chiao Tung University, Taiwan in 1996 and 1998, respectively, and his Ph.D. degree in electrical and computer engineering from Cornell University in 2008. In 2000, he joined the Taiwan Semiconductor Manufacturing Company (TSMC). From 2001 to 2003, he was also a TSMC assignee at International SEMATECH, Austin, TX. In 2008, he joined the Department of Electronics Engineering, National Chiao Tung University (NCTU) (as National Yang Ming Chiao Tung University (NYCU) since 2021), where he is currently a Chair Professor. Dr. Hou is also the Program Director of Angstrom Semiconductor Initiative, one of the largest national research programs for advanced semiconductors. In 2022, Dr. Hou became the Director General of Taiwan Semiconductor Research Institute (TSRI), one of the National Applied Research Laboratories in Taiwan focusing on semiconductor technology. He was the Associate Vice President for Research & Development at NYCU, the Director of EECS International Graduate Program, and the Deputy Director of Microelectronics and Information Research Center at NCTU. He was also the R&D Director of the Electronic and Optoelectronic System Research Lab at the Industrial Technology Research Institute (ITRI). His research interests include the emerging nonvolatile memory for embedded and high-density data storage, electronic synaptic device and neuromorphic computing systems, and heterogeneous integration of silicon electronics with low-dimensional and low-temperature nanomaterials.

Dr. Hou has published more than 250 technical papers with citations>6400 and H-index 42, delivered more than 30 invited conference talks, and held 23 U.S. patents. He was also a recipient of the IEEE Electron Device Society (EDS) Ph.D. student fellowship, EDMA Outstanding Youth Award, CIEE Outstanding Electrical Engineering Professor Award, Micron Teacher Award, MOST Ta-You Wu Memorial Award, and MOST Outstanding Research Award (twice). He served on the technical program committees of major conferences, including VLSI, IEDM, IRPS, DRC, EDTM, ISCAS, etc. He is currently the Editorial Board Member of Scientific Reports, Associate Editor of IEEE Access, and Regional Editor of IEEE EDS Newsletter. He is also a Member of the Board of Directors of the IEEE Taipei Section and Advisor of the IEEE EDS NCTU student branch chapter.





TSRI 晶片服務業務說明



  • 莊英宗 Ying-Zong Juang
    • Taiwan Semiconductor Research Institute(TSRI) / Deputy Director General




  • 日期:2024年7月30日(二)
  • 時間:16:10 - 16:25
  • 地點:台中福容大飯店 櫻花桂花廳

Biography:

Ying-Zong Juang received his M.S. and Ph.D. degrees from electrical engineering of National Cheng Kung University, Taiwan, in 1992 and 1998, respectively. He joined the institute of Chip Implementation Center, Science-Based Industrial Park, Hsinchu, in October 1998. At CIC, he has majored in the RF circuit design and device modeling works. Furthermore, from 2001 to 2004, he joined a project to develop the CMOS MEMS platform. Since 2005, he is the researcher fellow and director of CISD/CIC and his interested topics include the technologies of wireless micro-sensing system. Therefore, he has organized several projects including RFIP methodology, RF SiP, CMOS MEMS/BioMEMS, sensor SOC, power IC, and silicon photonics. In these years, he has published more than 200 papers and 30 patterns. Now, he is the researcher fellow and deputy director general of TSRI/NARLs and in charge the roadmap of heterogeneous integration of intelligent sensing system.